The second keynote, Metal AM Powder Development for the Automotive Industry, provided timely information on material innovations. John E. Barnes, founder and managing director of The Barnes Group Advisors and CEO of TBC Training, shared his knowledge and expertise.
Sessions included:
- Identifying Parts for AM—a Methodology to Identify Suitable Applications for AM, From a Technical and Economic Perspective. Presenting: SLM, Kyle Adams, application engineer, SLM Solutions, and Jaideep Bangal, business development manager, Altair Engineering.
- Transitioning From Polymer to Metal AM. Presenting: Howard Kuhn, retired adjunct professor, University of Pittsburgh.
- An Analysis of Metal AM Capabilities—Design Constraints, Economics and Scalability—and Their Impact on Production Applications. Presenting: Alex Huckstepp, vice president, business development, Digital Alloys.
- Advanced Transportation: the Next AM Revolution. Presenting: Jon Walker, automotive specialist and business development manager, EOS North America.
- Post-Processing of 3D-Printed Metal Parts. Presenting: Kevin Brigden, additive manufacturing applications engineer, Renishaw.
- X-ray CT Technology for Quality Assurance of Metal-AM Parts. Presenting: Andrew Ramsey, X-ray/CT specialist, Nikon Metrology.
Tech Tours Include Ford and Linear AMS
Of course, not all learning took place in meeting rooms, as event attendees had the opportunity to tour the Ford Advanced Manufacturing Center in Redford, MI, and Linear AMS in Livonia, MI.
Attendees saw firsthand how Linear AMS creates 3D objects from digital CAD files in a variety of metals, producing previously impossible-to-construct shapes.
The $45-million Ford Advanced Manufacturing Center, home to more than 20 printers, collaborative robots and virtual/ augmented reality simulators, provided a great example of how the automotive company looks to technology to improve its manufacturing. 3DMP
See also: Renishaw Inc., Nikon Metrology, Inc., EOS of North America, Inc., SLM Solutions NA, Inc., 3Diligent Corporation
Technologies: