Bystronic Earns Product-Innovation Award

June 1, 2008

For its ByVention laser-beam-cutting machine, Bystronic, Hauppauge, NY, earned the 2007 Award for Product Innovation of the Year in the European laser-cutting market, presented by Frost & Sullivan. Frost & Sullivan’s research analyst noted that the system’s integrated laser source and precise motion-control unit, along with the shorter beam length and single, universal cutting head, help the machine achieve high accuracy in cutting operations.
Industry-Related Terms: LASER
View Glossary of Metalforming Terms


See also: Bystronic Inc.

Technologies: Cutting


Must be logged in to post a comment.
There are no comments posted.

Subscribe to the Newsletter

Start receiving newsletters.