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Oakland Univ. to Host Tool and Die Forum

Monday, November 2, 2009
 
On November 17, 2009, from 7:30 a.m. to 1 p.m., Oakland University’s School of Business Administration, Rochester Hills, MI, will host The Future of Tool and Die: An Industry Dialogue. The free event will explore the relationships between tool and die companies and their customers in the automotive value chain. The event begins with presentations from representatives of Ford Motor Co., Takata Stamping and the Center for Automotive Research. Attendees will then break out into groups to discuss and define some of the issues the industry faces, and develop action plans. To attend, e-mail Carrie Sliwinski at cmking@oakland.edu.

 

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