Page 82 - MetalForming October 2013

Previews
RFID Applications for Metalformers
Balluff, Inc. Booth S4343
Balluff, Florence, KY, a manu- facturer of industrial sensing, net- working, and RFID products, will showcase an assortment of new products for the fabricating, welding and stamping industries. Its new offerings will enable metalformers to:
• Track dies and other critical assets with Industrial RFID;
• Protect sensors, dies and presses with unique and targeted products; and
• Eliminate die repair due to cable damage with noncontact connectors that trans-
DaySet proves ideal for short and medi- um runs and prototyping.
Based on the “Hovis Die” principle but with an improved design, DaySet elimi- nates the need for high-cost progressive dies. The preassembled master com- pound die is precision-made to work
with the compound tooling and provide a complete system for producing flat blanks (such as washers) in a single press stroke. This two-post die set with adjustable guides includes a knockout and a key for irregular shapes.
www.daytonprogress.com
mit power and I/O data.
Quick-Change Compound Tool and Die Set
Dayton Progress Booth S4531
www.balluff.us
DaySet precision compound tooling—a complete tooling system for the produc- tion of high-quality, cost-effective stamped products in a single step operation—stars at the booth of Dayton Progress, Dayton, OH. Boasting a 15-min. tool changeover time,
80 MetalForming/October 2013
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