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ETA Overview
For more than 30 years, ETA has been a leading technology develop- ment firm with specialized industry experience and cutting-edge tech- nology achievements.The company offers a variety of engineering con- sulting services, including comput- er aided engineering (CAE) analy- sis, product design and product development.
ETA provides engineering and development services from Concept to Product.The company offers a variety of services including product design, product development, com- puter aided engineering (CAE) analy- sis and IT services. A tier-one supplier to the global automotive industry, it offers expertise in NVH, metalform- ing, crashworthiness, occupant safety and product design.
Simulation and analysis expertise, met with lessons learned consulting for the largest auto manufacturers over the last three decades, led to the development of eta/VPG® and eta/DYNAFORM®, two of its flagship software products.
eta/DYNAFORM®
Perhaps its most popular software tool, DYNAFORM, is a complete die system simulation solution. It is the most accurate and cost-effective die analysis solution available today. Its formability simulation module allows engineers to create a “virtual stamp- ing tryout”, which allows users to pre- dict forming problems such as crack- ing, wrinkling, thinning and spring- back before any physical tooling is produced. Using DYNAFORM, it is possible to stamp a part perfectly on the very first hit.
The software solution can validate die design, reduce die development time, improve manufacturing efficien- cy and increase profitability. It allows organizations to bypass soft tooling, reducing overall tryout time, lower-
and progressive die designs. In depth analysis with FS uncovers hidden problem areas and enables designers to optimize designs based on accu- rate forming results.
To predict many stamping related concerns within the die production line, Die System Analysis (DSA), is used to analyze scrap shedding/ removal, die structural integrity and sheetmetal transferring/handling.
The new Optimization Platform (OP) helps users to go beyond identi- fying problem areas, by incorporat- ing design optimization to improve performance and quality—reducing wrinkling, thinning and tearing.
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ing costs,
increasing pro- ductivity and
providing com- plete confidence in die system
design. It also allows for the evalua-
tion of alternative and unconventional designs and
materials. By simulating every detail during the design stage, DYNAFORM ensures the highest quality formed part and most efficient manufactur- ing process possible.
For cost estimators, the Blank Size Engineering (BSE) module is widely used for estimating blank size, along with blank nesting for maximum material usage, scrap and piece price. It also can be used to predict thinning, thickening and also to gen- erate a forming limit diagram (FLD).
A complete die face engineering package, Die Face Engineering (DFE) is used to create tooling design, including binder and addendum, from the part geometry.
The Formability Simulation (FS) module facilitates the rapid develop- ment and validation of single-station
1133 E. Maple Rd, Suite 200 Troy, MI 48083 248/729-3010 www.eta.com/dynaform etainfo@eta.com
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