Page 34 - MetalForming June 2009

APMA wEards
of
xcellence
The Best of 2009
Excellence in Design
Zierick Manufacturing Corp
Zierick Manufacturing Corp., Mount Kisco, NY, a stamper of electronic components and provider of automation equipment such as inser- tion machines related to electronics- parts production, received the 2009 Higgins-Caditz Design Award for devel- oping a metal-stamping-based system for connecting wires to surface-mount printed circuit boards (PCBs).
Previous methods of attaching wires to PCBs were complex, labor-intensive and costly, and required an excessive amount of bulky parts. Zierick Manu- facturing’s goals in developing a new system included simplifying the process, miniaturizing parts and maintaining reliability while minimizing costs. To reach those goals, the company developed an insulation-piercing crimp terminal.
The terminal consists of a unique flat base for solder adhesion when sur- face mounting, with two insulation- piercing contact spikes protruding from the base. The terminal has two side- walls perpendicular to the base as well as two deep grooves in the transition area between the crimp ears and the base. These ensure that crimping a wire
2009
Nine companies, in eight categories, represent the best our industry offers.
Higgins-Caditz Design Award
Zierick Manufacturing Corp., Mount Kisco, NY
Ulbrich Award for Competitive Excellence in Product Development
Radar Industries, Warren, MI
Zierick Manufacturing Corporation Productivity Award
ART Technologies, Hamilton, OH
Link Systems Process Control Award
Pridgeon & Clay, Inc., Grand Rapids, MI
Parkview Metal Products Excellence in Quality Award
Pridgeon & Clay, Inc., Grand Rapids, MI
Pitcher Insurance Agency Safety Award
Trans-Matic Manufacturing Co., Holland, MI
A.R. Hedberg Training and Education Award (via HPL stampings, Inc.)
The Minster Machine Company, Minster, OH; Pridgeon & Clay, Inc., Grand Rapids, MI
Clips & Clamps Industries Educational Institution Award
William D. Ford Career-Technical Center, Westland, MI
32 METALFORMING / JUNE 2009
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into the terminal and forming the crimp ears around the wire do not subject the solder joint on the circuit board to stress cracking.
Inside the terminal, between the two contact spikes, a flat area facilitates vac- uum pickup of the terminal by surface- mount placement systems. The terminal is placed and soldered onto the PCB with all of the other components, all using the same process and the same auto- mated system. Upon attachment of the terminal to the PCB, the wire can be crimped at any time, on the assembly line or in the field. Importantly, no wire stripping is required. A terminating tool wraps the crimp ears around the wire, ensuring a good electrical con- nection by forcing the piercing spikes into the wire strands. This insulation- piercing process requires significantly