Rofin Acquisition Targets Brittle-Material Laser Processing
April 1, 2014Comments
Cutting and drilling of glass, sapphire and semiconductor substrates—that’s the focus of the laser technology developed by FiLaser, Portland, OR, which has agreed to be acquired by Rofin-Sinar Technologies, Plymouth, MI. The transaction, which includes all intellectual property including trademarks and patents, was expected to close in March.
See also: Rofin-Sinar, Inc.
Technologies: Cutting