Die-System Simulation
March 1, 2008Comments
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Engineering Technology Associates (ETA), Troy, MI, offers Dynaform 5.6 for die simulation. Dynaform allows users to entirely bypass soft tooling, thus reducing overall tryout time, lowering costs, increasing productivity and providing complete confidence in die-system design, according to company officials. It also allows evaluation of alternative and unconventional designs and materials.
See also: ETA (Engineering Technology Associates, Inc.)
Technologies: Software
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