Complete Die-System Simulation Solution
Monday, September 19, 2011
Engineering Technology Associates will demonstrate its latest version of Dynaform simulation software that allows organizations to bypass soft tooling and reduce tryout time and costs, and improves cycle times and productivity. The software features 3D capabilities and is designed to improve efficiency by streamlining all phases of die development. Modules include Blank Size Engineering, Die Face Engineering, Formability Simulation and Die System Analysis.
See also: ETA Software, Inc.
Related Enterprise Zones: Sensing/Electronics
There are no comments posted at this time.